Optical Packaging Engineers / Semiconductor Packag

Optical Packaging Engineers or Semiconductor Packaging Engineers sought by a leader in Laser technology with an international reputation offering a dynamic and enjoyable working environment. You will be developing custom packages for Fibre Coupled Semiconductor Laser Diodes with a focus on the Packaging Design and the Packaging Process for the Housing / Connector of the Semiconductor Chip on Mount / Chip on Submount / Chip on Carrier and Fused Fibre Component aspects of the Fibre Laser and Semiconductor Laser technology. Taking products from prototype to volume manufacture you will be undertaking Design for manufacture on aspects such as Die Attach, Solder methods, Cooling Optimisation – Heat Sinks, Wirebonding, Fibre to Diode Coupling, Epoxy Attach, Encapsulation, Microalignment / Micromanipulation, Package Welding / Laser Welding, Hermetic Sealing and Thermal Stability. Looking at issues of Reliability including life testing and qualification methods to Telcordia standards or similar, plus Mechanical Structure analysis, will also be key aspects of your responsibility, as will be the reduction of cost, yield improvement and process optimisation.

BSc+ in Optical Engineering / Mechanical Engineering or Physics with experience ideally in Fibre Coupling, Fused Component or Laser Diode Packaging including DPSS ( Diode Pumped Solid State ) or Metal / BGA / Plastic / MCM ( Multi Chip Module ) type packaging, through to Epoxy encapsulation. Experience in DFM or NPI in a microscale device packaging environment particularly advantageous for Senior roles as is FEA Analysis and Thermal Modelling. Applications from candidates from Optical Telecommunications, Semiconductor Devices or Optical Fibre technologies such as EDFAs, Fibre Amplifiers or WDM / DWDM devices are also welcome. More vacancies at www.remjobs.co.uk SKILLS: Optical Packaging Engineer, Semiconductor Packaging, Fibre Coupled Semiconductor Laser Diodes, Packaging Design, Packaging Process, Housing, Connector, Chip on Mount, Semiconductor Chip on Submount, Chip on Carrier, Fused Fibre Component, Fused Component, Fibre Laser, Semiconductor Laser, Prototype to Volume Manufacture, Die Attach, Solder methods, Cooling Optimisation, Heat Sinks, Wirebonding, Gold Wire Bonds, Fibre to Diode Coupling, Epoxy Attach, Encapsulation, Microalignment, Micromanipulation, Package Welding, Hermetic Sealing, Thermal Stability, Reliability, Life Testing, Qualification methods, Telcordia standards, Mechanical Structure analysis, Opto, Optical Engineering, Mechanical Engineering, Physics, Physicists, Fibre Coupling, Diode Packaging, DPSS, Diode Pumped Solid State, Metal packaging, BGA packaging, Plastic packaging, Epoxy encapsulation, Metal packages, BGA packages, Plastic packages, DFM, NPI Optical Telecommunications, Semiconductor Devices, Optical Fibre, EDFAs, Fibre Amplifiers, WDM, Yield Improvement, Process optimisation, MCM, FEA, Thermal Modelling.

REF: RR / 55936