Mechanical Engineer Telecommunications Electronic Packaging

• The candidate will be responsible for engineering mechanical solutions to electronic packaging challenges at the chip level, board level, enclosure level, and Data Center level. Custom indoor and outdoor enclosure design & development will be a major area of focus, protecting custom circuit board designs from harsh environments.
• This person will participate in the full product life cycle from Concept Industrial Design, Analysis, CAD Development, Prototyping, Testing, Production Release, and ongoing Production Support.

Requirements:

• BSME (or MSME) in Mechanical Engineering.
• 10+ years of experience in Telecommunications Electronic Packaging.
• 5+ years using 3D CAD System CREO.
• 5+ years of broad material design for high volume fabrication techniques (including plastics, die castings, extrusions, sheet metal, & elastomers).

Preferred Qualifications:

• Experience performing Thermal Analysis & Structural Analysis.
• Knowledge with environmental test standards MIL-STD-810 & DO-160.
• Technical awareness of UL safety standards, EMI/EMC standards, and design techniques to achieve compliance.
• Familiarity with DFMA & DFMEA.
• Project lead & Project management experience.

Job Types: Full-time, Contract, Permanent

Pay: $54.89 – $66.00 per hour

Benefits:

• 401(k)
• Dental insurance
• Health insurance
• Vision insurance

Schedule:

• 8 hour shift
• Day shift
• Monday to Friday

Ability to commute/relocate:

• Germantown, MD: Reliably commute or planning to relocate before starting work (Required)

Work Location: One location